多片水平晶圆盒

上下盖内绷环设计有效减少晶圆横向移动。上下盖采用扣位配合设计方案，有效避免了运输过程中上盖脱出问题。盖内的弹片设计能有效避免晶圆移动，防止晶圆破损，以及减少微尘产生。The top cover marks the opening and closing directions for the user to put on or remove the wafer. The buckle position matching design effectively avoids the problem of the upper cover falling out during the transportation process. Spring design inside the cover can effectively avoid the wafer movement, prevent wafer breakage, minimize particle generation.